![[Case Study] Company F - Functional Plating on Resin Cases](https://image.mono.ipros.com/public/product/image/c78/2000648148/IPROS56829308758047563908.png?w=280&h=280)
[Case Study] Company F - Functional Plating on Resin Cases
Plastic is used for the case designed for substrate mounting! Functional plating ensures shielding and achieves lightweight design.
In wireless devices, circuit boards that handle tiny analog signals are sometimes placed in aluminum machined cases to separate them from other digital signals and ensure shielding effectiveness. Company F is looking for ways to reduce weight and costs while maintaining shielding effectiveness, and they consulted with us, a company with a proven track record in resin processing. In response, we proposed applying functional plating to a resin case to ensure shielding performance and initially received an order for a prototype. As a result, we contacted several plating companies, collaborated with the company we are currently working with on prototypes, and the effectiveness was confirmed through performance evaluations by Company F, leading to product commercialization. [Challenges] - Ensure shielding performance - Reduce weight - Reduce costs *Many other cases are also featured. For more details, please refer to our "Contract Case Collection" or feel free to contact us.
- 企業：高和電氣工業
- 価格：Other
